CSP 1515 Series

• Ultra-compact size and high-density integration: CSP is directly packaged on the chip surface, with a volume close to that of the bare chip, enabling high-density arrangement applications.

• Wide-angle emission: Optimized optical structure achieves omnidirectional uniform light emission, eliminating the uneven spot issues typical of traditional packaging. This feature makes it an ideal choice for TV backlighting and panel light products, providing optical performance with no dark areas, a high color gamut, and reduced system design complexity.

• Dimensions:1.5*1.5*0.3mm